The present invention relates to a quad flat non-leaded package comprising: a lead frame, a semiconductor chip, a plurality of connecting wires and a molding compound. The lead frame has a plurality of leads, a die pad, a plurality of supporting bars and an external ring. The external ring is disposed around the die pad and is in contact with the semiconductor chip so as to increase the supporting to the semiconductor chip. The area of the semiconductor chip is larger than that of the die pad, and the semiconductor chip is attached to the die pad through its active surface. The molding compound encapsulates the lead frame, semiconductor chip and connecting wires, wherein part of the leads of the lead frame is exposed to the outside of the molding compound so as to be electrically connected to an external device.