Invention Grant
- Patent Title: Thickness control method and double side polisher
- Patent Title (中): 厚度控制方法和双面抛光机
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Application No.: US11359397Application Date: 2006-02-23
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Publication No.: US07147541B2Publication Date: 2006-12-12
- Inventor: Hitoshi Nagayama , Yusuke Inoue
- Applicant: Hitoshi Nagayama , Yusuke Inoue
- Applicant Address: JP Ayase
- Assignee: Speedfam Co., Ltd.
- Current Assignee: Speedfam Co., Ltd.
- Current Assignee Address: JP Ayase
- Agency: Morrison & Foerster LLP
- Priority: JP2005-050404 20050225
- Main IPC: B24B49/00
- IPC: B24B49/00

Abstract:
The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.
Public/Granted literature
- US20060194511A1 Thickness control method and double side polisher Public/Granted day:2006-08-31
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