Invention Grant
- Patent Title: Method of making high speed circuit board
- Patent Title (中): 制造高速电路板的方法
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Application No.: US10811817Application Date: 2004-03-30
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Publication No.: US07152319B2Publication Date: 2006-12-26
- Inventor: Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
- Applicant: Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattel, LLP
- Agent Lawrence R. Fraley
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
Public/Granted literature
- US20040231888A1 High speed circuit board and method for fabrication Public/Granted day:2004-11-25
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