Invention Grant
- Patent Title: Ground plane for integrated circuit package
- Patent Title (中): 集成电路封装的接地层
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Application No.: US10873817Application Date: 2004-06-21
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Publication No.: US07154175B2Publication Date: 2006-12-26
- Inventor: Udy A. Shrivastava , Kristopher Frutschy
- Applicant: Udy A. Shrivastava , Kristopher Frutschy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.
Public/Granted literature
- US20050280138A1 Ground plane for integrated circuit package Public/Granted day:2005-12-22
Information query
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