Invention Grant
- Patent Title: Integrated VI probe
- Patent Title (中): 集成VI探头
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Application No.: US10504159Application Date: 2003-02-27
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Publication No.: US07154256B2Publication Date: 2006-12-26
- Inventor: Richard Parsons , Robert Jackson , Deana R. Delp
- Applicant: Richard Parsons , Robert Jackson , Deana R. Delp
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- International Application: PCT/US03/05048 WO 20030227
- International Announcement: WO03/075300 WO 20030912
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
Integrated voltage and current (VI) probe (18) for integration inside a transmission line (17) having inner (3) and an outer (4) conductors. Current probes, often implemented as loop antennas, can be coupled to the outer conductor. The probes can either be built onto the same panel or on different panels.
Public/Granted literature
- US20050184668A1 Integrated vi probe Public/Granted day:2005-08-25
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