发明授权
- 专利标题: Direct contact semiconductor cooling
- 专利标题(中): 直接接触半导体冷却
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申请号: US10849097申请日: 2004-05-19
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公开(公告)号: US07157793B2公开(公告)日: 2007-01-02
- 发明人: Richard S. Torkington , Jon Filreis , Kenneth V. Buer
- 申请人: Richard S. Torkington , Jon Filreis , Kenneth V. Buer
- 申请人地址: US AZ Chandler
- 专利权人: U.S. Monolithics, L.L.C.
- 当前专利权人: U.S. Monolithics, L.L.C.
- 当前专利权人地址: US AZ Chandler
- 代理机构: Snell & Wilmer L.L.P.
- 主分类号: H01L23/34
- IPC分类号: H01L23/34 ; G01R31/26
摘要:
Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.
公开/授权文献
- US20050098880A1 Direct contact semiconductor cooling 公开/授权日:2005-05-12
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