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    Direct contact semiconductor cooling
    1.
    发明授权
    Direct contact semiconductor cooling 有权
    直接接触半导体冷却

    公开(公告)号：US07157793B2

    公开(公告)日：2007-01-02

    申请号：US10849097

    申请日：2004-05-19

    申请人： Richard S. Torkington ,  Jon Filreis ,  Kenneth V. Buer

    发明人： Richard S. Torkington ,  Jon Filreis ,  Kenneth V. Buer

    IPC分类号： H01L23/34 ,  G01R31/26

    CPC分类号： H01L23/44 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.

    摘要翻译： 通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。 例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。 因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。 此外，本文描述了实现该密封的示例性方法。

    High power block upconverter
    3.
    发明授权
    High power block upconverter 有权

    公开(公告)号：US07035617B2

    公开(公告)日：2006-04-25

    申请号：US10066024

    申请日：2002-01-29

    申请人： Kenneth V. Buer ,  Richard S. Torkington ,  Edwin Jack Stanfield

    发明人： Kenneth V. Buer ,  Richard S. Torkington ,  Edwin Jack Stanfield

    IPC分类号： H04B1/26

    CPC分类号： H04B1/26

    摘要： A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a “drop-in” component capable of mixing a local oscillator signal with an IF signal to produce an RF signal in the millimeter-wave and higher bands. In addition, the HP-BUC provides filtering of unwanted spurious signals and requires no further signal amplification prior to transmission, for example in a satellite communications system.

    Satellite communications systems using satellites in a zero-drift constellation
    5.
    发明授权
    Satellite communications systems using satellites in a zero-drift constellation 失效
    使用零漂移星座中的卫星的卫星通信系统

    公开(公告)号：US06198907B1

    公开(公告)日：2001-03-06

    申请号：US09016976

    申请日：1998-02-02

    申请人： Richard S. Torkington ,  Thomas P. Emmons, Jr. ,  Keith Warble

    发明人： Richard S. Torkington ,  Thomas P. Emmons, Jr. ,  Keith Warble

    IPC分类号： H04B7185

    CPC分类号： H04B7/18541 ,  H04B7/195

    摘要： A zero-drift constellation (200 FIG. 2) is used to simplify the tracking and hand-off requirements of terrestrial-based user terminals (110 FIG. 1). Each satellite (120 FIG. 1) traces out a common ground track which has a number of southbound segments and an equal number of adjacent northbound segments. This allows user terminals (110) to employ antennas with only one degree of freedom to track satellites (120) in zero-drift constellation (200). User terminals (110) perform hand-offs with satellites (120) that are within a limited field of view with respect to user terminal (110). User terminal (110) tracks a first satellite until a crossover point is reached and then performs a hand-off to a second satellite traveling in the opposite direction along an adjacent segment. User terminal (110) tracks the second satellite until another crossover point is reached and then performs a hand-off to a third satellite traveling in the same direction as the first satellite along an adjacent segment.

    摘要翻译： 零漂移星座（200图2）用于简化基于地面的用户终端的跟踪和切换要求（图1的110）。 每个卫星（120图1）描绘出具有多个南向段和相等数量的相邻北行段的公共地面轨道。 这允许用户终端（110）采用仅具有一个自由度的天线来跟踪零漂移星座图（200）中的卫星（120）。 用户终端（110）执行与卫星（120）的切换，所述卫星相对于用户终端（110）在有限的视场内。 用户终端（110）跟踪第一卫星直到达到交叉点，然后执行到沿相邻段沿相反方向行进的第二卫星的切换。 用户终端（110）跟踪第二卫星直到达到另一个交叉点，然后执行与沿着相邻段的与第一卫星相同的方向行进的第三卫星的切换。

    High isolation packaging method
    6.
    发明授权
    High isolation packaging method 失效
    高隔离包装方法

    公开(公告)号：US5222294A

    公开(公告)日：1993-06-29

    申请号：US783743

    申请日：1992-01-21

    申请人： Richard S. Torkington ,  David G. Lamoreaux

    发明人： Richard S. Torkington ,  David G. Lamoreaux

    IPC分类号： H01L23/552 ,  H05K9/00

    CPC分类号： H01L23/552 ,  H05K9/0022 ,  H01L2924/1616 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49146

    摘要： A microwave circuit high isolation packaging technology involving the fabrication of a single-piece baseplate containing microwave circuits, the fabrication of a single-piece framework, and the assembly of the baseplate structure to the framework structure eliminating any gaps. The baseplate contains the desired microwave circuitry without isolation channels or other impediments to mounting circuit components or making circuit interconnections. The framework comprises all isolation walls, transoms, or other structures capable of isolating individual portions of the microwave circuit when assembled to the baseplate.

    摘要翻译： 微波电路高隔离封装技术涉及制造包含微波电路的单片基板，制造单件式框架，以及将基板结构组装到框架结构上，消除任何间隙。 底板包含所需的微波电路，没有隔离通道或其他障碍，用于安装电路组件或进行电路互连。 框架包括当组装到基板上时能够隔离微波电路的各个部分的所有隔离壁，横梁或其它结构。

    High isolation packaging technology
    7.
    发明授权
    High isolation packaging technology 失效
    高隔离包装技术

    公开(公告)号：US5160903A

    公开(公告)日：1992-11-03

    申请号：US620878

    申请日：1990-12-03

    申请人： Richard S. Torkington ,  David G. Lamoreaux

    发明人： Richard S. Torkington ,  David G. Lamoreaux

    IPC分类号： H01L23/552 ,  H05K9/00

    CPC分类号： H05K9/0056 ,  H01L23/552 ,  H01L2924/1616

    摘要： A microwave circuit high isolation packaging technology involving the fabrication of a single-piece baseplate containing microwave circuits, the fabrication of a single-piece framework, and the assembly of the baseplate structure to the framework structure eliminating any gaps. The baseplate contains the desired microwave circuitry without isolation channels or other impediments to mounting circuit components or making circuit interconnections. The framework comprises all isolation walls, transoms, or other structures capable of isolating individual portions of the microwave circuit when assembled to the baseplate.

    摘要翻译： 微波电路高隔离封装技术涉及制造包含微波电路的单片基板，制造单件式框架，以及将基板结构组装到框架结构上，消除任何间隙。 底板包含所需的微波电路，没有隔离通道或其他障碍，用于安装电路组件或进行电路互连。 框架包括当组装到基板上时能够隔离微波电路的各个部分的所有隔离壁，横梁或其它结构。