Invention Grant
- Patent Title: Thermally reversible implant and filler
- Patent Title (中): 热可逆植入物和填充物
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Application No.: US10428520Application Date: 2003-05-02
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Publication No.: US07160931B2Publication Date: 2007-01-09
- Inventor: Yu-Ling Cheng , Michael H. May , John L. Semple , Hai-Hui Lin
- Applicant: Yu-Ling Cheng , Michael H. May , John L. Semple , Hai-Hui Lin
- Agency: Brown Rudnick Berlack Israels LLP
- Agent Thomas M. Saunders
- Main IPC: A61F2/00
- IPC: A61F2/00 ; C08L51/00 ; C08L53/00

Abstract:
The invention relates to the use of a thermal reversible gel, such as a copolymer composition, as a biological filler or implant. The gel has a semi-solid form at body temperature, but upon cooling to a temperature below a threshold level, the gel is liquefied and can be re-shaped, re-sized, manipulated or removed from the body. The gel may be used as a subcutaneous implant, a biological filler, joint or tissue spacer, for wrinkle filling or other cosmetic implants, as a soft-tissue replacement for reconstructive surgery, or as a barrier within the lumen of a biological structure, such as a blood vessel. The implant may be used to provide reversible birth control by providing, for example, a reversible barrier to the cervix or a reversible blockage of the lumen of the vas deferens.
Public/Granted literature
- US20040029994A1 Thermally reversible implant and filler Public/Granted day:2004-02-12
Information query
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