Invention Grant
- Patent Title: High brightness light-emitting device and manufacturing process of the light-emitting device
- Patent Title (中): 高亮度发光装置及制造工艺的发光装置
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Application No.: US10870347Application Date: 2004-06-17
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Publication No.: US07166483B2Publication Date: 2007-01-23
- Inventor: Yu-Chuan Liu , Chia-Ming Lee , I-Ling Chen , Jen-Inn Chyi
- Applicant: Yu-Chuan Liu , Chia-Ming Lee , I-Ling Chen , Jen-Inn Chyi
- Applicant Address: TW
- Assignee: Tekcore Co., Ltd.
- Current Assignee: Tekcore Co., Ltd.
- Current Assignee Address: TW
- Agency: Baker & McKenzie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A light-emitting device comprises a multi-layer structure including one or more active layer configured to irradiate light in response to the application of an electric signal, a transparent passivation layer laid over an outmost surface of the multi-layer stack, a reflector layer laid over the passivation layer, and a plurality of electrode pads coupled with the multi-layer structure. In a manufacture process of the light-emitting device, the reflector layer and the passivation layer are patterned to form at least one opening exposing an area of the multi-layer structure. One electrode pad is formed through the opening of the reflector layer and the passivation layer to connect with the multi-layer structure.
Public/Granted literature
- US20050279990A1 High brightness light-emitting device and manufacturing process of the light-emitting device Public/Granted day:2005-12-22
Information query
IPC分类: