Invention Grant
- Patent Title: Process for making a micro-fluid ejection head structure
- Patent Title (中): 制造微流体喷射头结构的方法
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Application No.: US10937968Application Date: 2004-09-10
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Publication No.: US07169538B2Publication Date: 2007-01-30
- Inventor: Craig M. Bertelsen , Brian C. Hart , Gary A. Holt, Jr. , Gary R. Williams , Sean T. Weaver
- Applicant: Craig M. Bertelsen , Brian C. Hart , Gary A. Holt, Jr. , Gary R. Williams , Sean T. Weaver
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Agency: Luedeka, Neely & Graham
- Main IPC: B41J2/16
- IPC: B41J2/16

Abstract:
A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.
Public/Granted literature
- US20060057503A1 Process for making a micro-fluid ejection head structure Public/Granted day:2006-03-16
Information query
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