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12 条记录 (耗时 0.026 秒)

    Orifice plate protection device
    1.
    发明授权
    Orifice plate protection device 失效
    孔板保护装置

    公开(公告)号：US07540584B2

    公开(公告)日：2009-06-02

    申请号：US11095955

    申请日：2005-03-31

    申请人： Craig M. Bertelsen ,  Richard Michael Moore ,  Dell T. Rosa ,  Jeffery L. Sangalli ,  Jerry E. Stokesbary ,  Melissa M. Waldeck

    发明人： Craig M. Bertelsen ,  Richard Michael Moore ,  Dell T. Rosa ,  Jeffery L. Sangalli ,  Jerry E. Stokesbary ,  Melissa M. Waldeck

    IPC分类号： B41J2/165

    CPC分类号： B41J2/17536

    摘要： An orifice plate sealing tape for an orifice plate of a micro-fluid ejection device and methods for sealing an orifice plate with the sealing tape. The sealing tape includes a flexible polymeric backing film and a radiation cured adhesive applied to a surface of the orifice plate. The adhesive is cured in a pattern sufficient to seal adjacent to nozzle holes in the orifice plate and to enhance removal of the backing film and adhesive from the orifice plate prior to use of the micro-fluid ejection device. Upon removal of the sealing tape, a minimum of residue is left on the nozzle plate surface adjacent to and/or in the nozzle holes.

    摘要翻译： 用于微流体喷射装置的孔板的孔板密封带和用密封带密封孔板的方法。 密封带包括柔性聚合物背衬膜和施加到孔板表面的辐射固化粘合剂。 粘合剂以足以与孔板中的喷嘴孔相邻密封的图案固化，并且在使用微流体喷射装置之前增强背衬膜和粘合剂从孔板的去除。 在去除密封带时，在喷嘴板表面上留下最少的残留物和/或在喷嘴孔中。

    Polyimide thickfilm flow feature photoresist and method of applying same
    2.
    发明授权
    Polyimide thickfilm flow feature photoresist and method of applying same 有权
    聚酰亚胺厚膜流动特征光致抗蚀剂及其应用方法

    公开(公告)号：US07204574B2

    公开(公告)日：2007-04-17

    申请号：US10881806

    申请日：2004-06-30

    申请人： Craig M. Bertelsen ,  Sean T. Weaver

    发明人： Craig M. Bertelsen ,  Sean T. Weaver

    IPC分类号： B41J2/015

    CPC分类号： B41J2/17559

    摘要： A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potential for HF to interact with the ink, and which can cause flocculation and eliminate the need for extremely long postbake cures used to remove HF from the photoresist. In another embodiment, an epoxy adhesive containing a dicyandiamide catalyst can be used to improve adhesion between polyimide films and a respective substrate.

    摘要翻译： 用于厚膜流动特征的聚酰亚胺光致抗蚀剂粘附到聚酰亚胺喷嘴板或其它材料上，而不使用两个表面之间的粘合剂材料。 此外，光致抗蚀剂可以利用丙烯酸酯UV引发剂，其可以降低HF与墨水相互作用的可能性，并且其可引起絮凝，并且不需要用于从光致抗蚀剂中除去HF的极长的后烘烤固化物。 在另一个实施方案中，可以使用含有双氰胺催化剂的环氧粘合剂来改善聚酰亚胺膜和相应基材之间的粘附性。

    Die attach methods and apparatus for micro-fluid ejection device
    3.
    发明授权
    Die attach methods and apparatus for micro-fluid ejection device 有权
    微流体喷射装置的贴片方法和装置

    公开(公告)号：US07311386B2

    公开(公告)日：2007-12-25

    申请号：US10880898

    申请日：2004-06-30

    申请人： Craig M. Bertelsen ,  James M. Mrvos ,  Paul T. Spivey ,  Melissa M. Waldeck ,  Sean T. Weaver

    发明人： Craig M. Bertelsen ,  James M. Mrvos ,  Paul T. Spivey ,  Melissa M. Waldeck ,  Sean T. Weaver

    IPC分类号： B41J2/05 ,  G01D15/00 ,  G11B5/127

    CPC分类号： B41J2/17559

    摘要： A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

    摘要翻译： 微流体喷射装置结构，包含喷射装置结构的多流体盒，以及用于制造喷射装置结构和盒的方法。 喷射装置包括具有流体供给侧和装置侧的喷射头基板，并且在其中包含用于将流体从流体供应侧供应到其装置侧的两个或更多个流体流动路径。 多通道歧管连接到喷射头基板的流体供应侧，用于将流体从两个或更多个流体储存器提供到喷射头基板中的流体流动路径。 多通道歧管在其中具有与喷射头基底中的流体流动通路的流体流动通道，并且歧管基本上由图案化的光致抗蚀剂材料组成。

    Planarization layer for micro-fluid ejection head substrates
    4.
    发明授权
    Planarization layer for micro-fluid ejection head substrates 有权
    用于微流体喷射头基板的平面化层

    公开(公告)号：US07905569B2

    公开(公告)日：2011-03-15

    申请号：US10941493

    申请日：2004-09-15

    申请人： Byron V. Bell ,  Craig M. Bertelsen ,  Brian C. Hart ,  Girish S. Patil ,  Sean T. Weaver

    发明人： Byron V. Bell ,  Craig M. Bertelsen ,  Brian C. Hart ,  Girish S. Patil ,  Sean T. Weaver

    IPC分类号： B41J2/015 ,  B41J2/05

    CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1631

    摘要： A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.

    摘要翻译： 一种用于微流体喷射头基板的基本上无机的平坦化层及其方法。 平坦化层包括由一个或多个电介质化合物组成的多个层和沉积在微流体的第二金属层上的总厚度范围为约1微米至约15微米的至少一个旋涂玻璃（SOG）层 喷射头基板。 平坦化层的最上层选自一种或多种介电化合物和硬掩模材料。

    Method of making a micro-fluid ejection device
    5.
    发明授权
    Method of making a micro-fluid ejection device 有权
    制造微流体喷射装置的方法

    公开(公告)号：US07690115B2

    公开(公告)日：2010-04-06

    申请号：US11386174

    申请日：2006-03-22

    申请人： Mary C. Smoot ,  Paul T. Spivey ,  Melissa M. Waldeck ,  Craig M. Bertelsen ,  Sean T. Weaver

    发明人： Mary C. Smoot ,  Paul T. Spivey ,  Melissa M. Waldeck ,  Craig M. Bertelsen ,  Sean T. Weaver

    IPC分类号： B21D53/76 ,  B32B38/14

    CPC分类号： B41J2/17559 ,  B41J2/17513 ,  B41J2/1752 ,  B41J2/17526 ,  B41J2/17553 ,  C07D235/18 ,  C07D401/12 ,  C07D403/12 ,  Y10S29/001 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49401 ,  Y10T29/49798 ,  Y10T156/1062

    摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

    摘要翻译： 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构或盒体上，用粘合线印刷粘合线密度为至少约1.2mm-1的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。

    Flexible circuit corrosion protection
    6.
    发明授权
    Flexible circuit corrosion protection 有权
    柔性电路腐蚀保护

    公开(公告)号：US07673970B2

    公开(公告)日：2010-03-09

    申请号：US10882728

    申请日：2004-06-30

    申请人： Craig M. Bertelsen ,  Sean T. Weaver

    发明人： Craig M. Bertelsen ,  Sean T. Weaver

    IPC分类号： B41J2/14

    CPC分类号： H05K3/28 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2002/14491 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2201/0179 ,  H05K2203/095

    摘要： A flexible circuit having improved corrosion resistance and method therefor. The flexible circuit includes, a polymeric support substrate, a conductive layer providing tracing attached to a first surface of the support substrate, and lead beams in electrical communication with the tracing for attaching the flexible circuit to a micro-fluid ejection head. A plasma polymerized layer is deposited on at least a portion of the conductive layer to reduce corrosion of the conductive layer. The plasma polymerized layer may also improve adhesion between the flexible circuit and an adhesive use to attach the flexible circuit to a structure.

    摘要翻译： 具有改进的耐腐蚀性的柔性电路及其方法。 柔性电路包括聚合物支撑衬底，提供附着到支撑衬底的第一表面上的跟踪的导电层和与跟踪电连接的引导梁，用于将柔性电路附接到微流体喷射头。 在导电层的至少一部分上沉积等离子体聚合层以减少导电层的腐蚀。 等离子体聚合层还可以改善柔性电路与将柔性电路连接到结构的粘合剂用途之间的粘附。

    Process for making a micro-fluid ejection head structure
    7.
    发明授权
    Process for making a micro-fluid ejection head structure 有权
    制造微流体喷射头结构的方法

    公开(公告)号：US07169538B2

    公开(公告)日：2007-01-30

    申请号：US10937968

    申请日：2004-09-10

    申请人： Craig M. Bertelsen ,  Brian C. Hart ,  Gary A. Holt, Jr. ,  Gary R. Williams ,  Sean T. Weaver

    发明人： Craig M. Bertelsen ,  Brian C. Hart ,  Gary A. Holt, Jr. ,  Gary R. Williams ,  Sean T. Weaver

    IPC分类号： B41J2/16

    CPC分类号： B41J2/164 ,  B41J2/1603 ,  B41J2/1645 ,  B41J2/1646

    摘要： A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.

    摘要翻译： 用聚合材料（例如，光致抗蚀剂）对衬底的器件表面进行干喷涂以在衬底的表面上提供喷涂层。 喷涂层具有约0.5至约20微米的厚度。 流动特征在喷涂层中形成（例如，成像和显影）。 将喷嘴板层施加到喷涂层。 喷嘴板层具有约5至约40微米的厚度，并且包含形成在其中的喷嘴孔以提供微流体喷射头结构。

    Die attach methods and apparatus for micro-fluid ejection device
    9.
    发明授权
    Die attach methods and apparatus for micro-fluid ejection device 有权
    微流体喷射装置的贴片方法和装置

    公开(公告)号：US07275815B2

    公开(公告)日：2007-10-02

    申请号：US11000763

    申请日：2004-12-01

    申请人： Craig M. Bertelsen ,  Kin M. Kwan ,  Sean T. Weaver

    发明人： Craig M. Bertelsen ,  Kin M. Kwan ,  Sean T. Weaver

    IPC分类号： B41J2/175

    CPC分类号： B41J2/1753 ,  B41J2/17513

    摘要： A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.

    摘要翻译： 微流体喷射装置结构，包含喷射装置结构的多流体盒，以及用于制造喷射装置结构和盒的方法。 微流体喷射装置结构包括其中包含至少三个流体供应槽的流体供应主体。 其中具有流体供给槽的喷射头基板附接到流体供应体。 身体中的每个流体供应槽与衬底中的至少一个流体供给槽流动连通。 多个粘合剂粘合线将喷射头基板和流体供给体彼此粘合地附接。 每个粘合剂粘合线具有小于约600微米的宽度，并且位于身体中相邻的流体供应槽之间。