发明授权
- 专利标题： Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
- 专利标题（中）： 电子组件包括具有集成电路的模具和用于传热的金刚石层
-
申请号： US11050902申请日： 2005-02-03
-
公开(公告)号： US07170098B2公开(公告)日： 2007-01-30
- 发明人: Gregory M. Chrysler , Abhay A. Watwe , Sairam Agraharam , Kramadhati V. Ravi , Michael C. Garner
- 申请人： Gregory M. Chrysler , Abhay A. Watwe , Sairam Agraharam , Kramadhati V. Ravi , Michael C. Garner
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L31/0312
- IPC分类号： H01L31/0312
摘要：
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
公开/授权文献
信息查询
IPC分类:
