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US07172981B2 Semiconductor integrated circuit device manufacturing method including static charge elimination 有权
半导体集成电路器件制造方法,包括静电消除

Semiconductor integrated circuit device manufacturing method including static charge elimination
摘要:
A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-charge-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
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