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发明授权
US07173828B2 Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure 有权
用于防止焊料挤出的接地焊盘结构和具有接地焊盘结构的半导体封装

Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure
摘要：
A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.
摘要（中）：

公开了一种用于防止焊料挤出的接地焊盘结构和具有接地焊盘结构的半导体封装，其中接地焊盘结构具有沿其接地平面的圆周定位的接地焊盘以非阻焊掩模定义的方式形成。 因此，保持良好的接地质量，并且可以避免相邻导电迹线之间的电桥接的发生，因为熔融焊料凸块从沿着接地焊盘结构的圆周朝向其相邻导电迹线的接地焊盘的挤出是有效的 防止了

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