发明授权
- 专利标题: Surface treatment system and method
- 专利标题(中): 表面处理系统及方法
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申请号: US10496219申请日: 2002-12-28
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公开(公告)号: US07175880B2公开(公告)日: 2007-02-13
- 发明人: Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
- 申请人: Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
- 申请人地址: KR Seoul
- 专利权人: LG Electronics Inc.
- 当前专利权人: LG Electronics Inc.
- 当前专利权人地址: KR Seoul
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR10-2002-0017512 20020329
- 国际申请: PCT/KR02/02471 WO 20021228
- 国际公布: WO03/083168 WO 20031009
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
A surface treatment system in which gas for a deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object or surface treatment, wherein the deposition chamber has a plurality of deposition spaces disposed in parallel and a convey unit for conveying one or more objects of surface treatment to each deposition space or discharging the objects of surface treatment from each deposition space after a deposition reaction.
公开/授权文献
- US20050051090A1 Surface treatment system and method 公开/授权日:2005-03-10