Invention Grant
- Patent Title: Methods of fabricating fin field effect transistors
- Patent Title (中): 散射场效应晶体管的制造方法
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Application No.: US10869763Application Date: 2004-06-16
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Publication No.: US07176067B2Publication Date: 2007-02-13
- Inventor: In-Soo Jung , Deok-Hyung Lee , Si-Young Choi , Byeong-Chan Lee , Yong-Hoon Son
- Applicant: In-Soo Jung , Deok-Hyung Lee , Si-Young Choi , Byeong-Chan Lee , Yong-Hoon Son
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2003-0042736 20030627
- Main IPC: H01L21/339
- IPC: H01L21/339

Abstract:
A method of forming a fin field effect transistor on a semiconductor substrate includes forming an active region in the substrate, forming an epitaxial layer on the active region, and removing a portion of the epitaxial layer to form a vertical fin on the active region. The fin has a width that is narrower than a width of the active region. Removing a portion of the epitaxial layer may include oxidizing a surface of the epitaxial layer and then removing the oxidized surface of the epitaxial layer to decrease the width of the fin. The epitaxial layer may be doped in situ before removing a portion of the epitaxial layer. The method further includes forming a conductive layer on a top surface and on sidewalls of the fin. Related transistors are also discussed.
Public/Granted literature
- US20040262687A1 Fin field effect transistors and fabrication methods thereof Public/Granted day:2004-12-30
Information query
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