Invention Grant
- Patent Title: Configuration and fabrication of semiconductor structure having n-channel channel-junction field-effect transistor
- Patent Title (中): 具有n沟道沟道结场效应晶体管的半导体结构
-
Application No.: US10803203Application Date: 2004-03-17
-
Publication No.: US07176530B1Publication Date: 2007-02-13
- Inventor: Constantin Bulucea , Philipp Lindorfer
- Applicant: Constantin Bulucea , Philipp Lindorfer
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Ronald J. Meetin
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor technology combines a normally off n-channel channel-junction insulated-gate field-effect transistor (“IGFET”) (104) and an n-channel surface-channel IGFET (100 or 160) to reduce low-frequency 1/f noise. The channel-junction IGFET is normally of materially greater gate dielectric thickness than the surface-channel IGFET so as to operate across a greater voltage range than the surface-channel IGFET. Alternatively or additionally, the channel-junction IGFET may conduct current through a field-induced surface channel. A p-channel surface-channel IGFET (102 or 162), which is typically of approximately the same gate-dielectric thickness as the n-channel surface-channel IGFET, is preferably combined with the two n-channel IGFETs to produce a complementary-IGFET structure. A further p-channel IGFET (106, 180, 184, or 192), which is typically of approximately the same gate dielectric thickness as the n-channel channel-junction IGFET, is also preferably included. The further p-channel IGFET can be a surface-channel or channel-junction device.
Information query
IPC分类: