发明授权
- 专利标题: Semiconductor devices having contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus
- 专利标题(中): 具有接触插塞的半导体器件包括掺杂有比磷少的扩散系数的杂质的多晶硅
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申请号: US10982113申请日: 2004-11-04
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公开(公告)号: US07176533B2公开(公告)日: 2007-02-13
- 发明人: Eun-Ae Chung , Myoung-Bum Lee , Young-Pil Kim , Jin-Gyun Kim , Bean-Jun Jin
- 申请人: Eun-Ae Chung , Myoung-Bum Lee , Young-Pil Kim , Jin-Gyun Kim , Bean-Jun Jin
- 申请人地址: KR Kyungki-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Kyungki-Do
- 代理机构: Myers Bigel Sibley & Sajovec
- 优先权: KR2002-0036487 20020627
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
Forming a semiconductor device can include forming an insulating layer on a semiconductor substrate including a conductive region thereof, wherein the insulating layer has a contact hole therein exposing a portion of the conductive region. A polysilicon contact plug can be formed in the contact hole wherein at least a portion of the polysilicon contact plug is doped with an element having a diffusion coeffient that is less than a diffusion coefficient of phosphorus (P). Related structures are also discussed.
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