Invention Grant
US07176537B2 High performance CMOS with metal-gate and Schottky source/drain
有权
具有金属栅极和肖特基源极/漏极的高性能CMOS
- Patent Title: High performance CMOS with metal-gate and Schottky source/drain
- Patent Title (中): 具有金属栅极和肖特基源极/漏极的高性能CMOS
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Application No.: US11134897Application Date: 2005-05-23
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Publication No.: US07176537B2Publication Date: 2007-02-13
- Inventor: Wen-Chin Lee , Chung-Hu Ke , Min-Hwa Chi
- Applicant: Wen-Chin Lee , Chung-Hu Ke , Min-Hwa Chi
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device having a metal/metal silicide gate and a Schottky source/drain and a method of forming the same are provided. The semiconductor device includes a gate dielectric overlying a semiconductor substrate, a metal or metal silicide gate electrode having a work function of less than about 4.3 eV or greater than about 4.9 eV overlying the gate dielectric, a spacer having a thickness of less than about 100 Å on a side of the gate electrode, and a Schottky source/drain having a work function of less than about 4.3 eV or greater than about 4.9 eV wherein the Schottky source/drain region overlaps the gate electrode. The Schottky source/drain region preferably has a thickness of less than about 300 Å.
Public/Granted literature
- US20060273409A1 High performance CMOS with metal-gate and Schottky source/drain Public/Granted day:2006-12-07
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