发明授权
- 专利标题: Semiconductor laser device and manufacturing method therefor
- 专利标题(中): 半导体激光器件及其制造方法
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申请号: US10715025申请日: 2003-11-18
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公开(公告)号: US07180925B2公开(公告)日: 2007-02-20
- 发明人: Yoshiaki Ueda , Keisuke Miyazaki , Kazuhiko Wada , Masaki Tatsumi , Taiji Morimoto
- 申请人: Yoshiaki Ueda , Keisuke Miyazaki , Kazuhiko Wada , Masaki Tatsumi , Taiji Morimoto
- 申请人地址: JP Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Morrison & Foerster LLP
- 优先权: JP2002-333509 20021118
- 主分类号: H01S5/00
- IPC分类号: H01S5/00
摘要:
A light confinement layer constructed of a semiconductor that has a refractive index different from that of p-type second cladding layers is formed to a small film thickness of not greater than 2 μm (about 0.5 μm) on the whole surface of ridge portions of two semiconductor lasers. Thus, the light confinement layer on the ridge portions is made roughly flat so as to be easily removable by etching. As a result, the exposure of p-type second cladding layers of the ridge portions due to deep etching is prevented to allow the confinement of light into the p-type cladding layers to be stably effected. A dielectric film is formed on the light confinement layer and reinforces the current constriction function lost by the reduction in the thickness of the light confinement layer.
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