Invention Grant
- Patent Title: Radiation curable resin composition and rapid prototyping process using the same
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Application No.: US10623153Application Date: 2003-07-21
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Publication No.: US07183040B2Publication Date: 2007-02-27
- Inventor: Jens C Thies , Aylvin J. A. A. Dias , John A. Lawton , David L. Winmill , Jigeng Xu , Xiaorong You
- Applicant: Jens C Thies , Aylvin J. A. A. Dias , John A. Lawton , David L. Winmill , Jigeng Xu , Xiaorong You
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/027
Abstract:
The invention relates to a radiation curable composition comprising relative to the total weight of the composition (A) 0–29 wt % of a cationically curable component having a linking aliphatic ester group, (B) 10–85 wt % of an epoxygroup containing component other than A, (C) 1–50 wt % of an oxetanegroup containing component, (D) 1–25 wt % of a multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator.
Public/Granted literature
- US20040142274A1 Radiation curable resin composition and rapid prototyping process using the same Public/Granted day:2004-07-22
Information query
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