Invention Grant
- Patent Title: Bottom heat spreader
- Patent Title (中): 底部散热器
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Application No.: US10877586Application Date: 2004-06-25
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Publication No.: US07190068B2Publication Date: 2007-03-13
- Inventor: Dale Hackitt , Robert Nickerson , Brian Taggart
- Applicant: Dale Hackitt , Robert Nickerson , Brian Taggart
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34 ; H01L21/50
Abstract:
Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
Public/Granted literature
- US20050285260A1 Bottom heat spreader Public/Granted day:2005-12-29
Information query
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