发明授权
- 专利标题： Selective capping of copper wiring
- 专利标题（中）： 铜线选择性封盖
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申请号： US11265302申请日： 2005-11-03
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公开(公告)号： US07190079B2公开(公告)日： 2007-03-13
- 发明人: Panayotis C. Andricacos , Shyng-Tsong Chen , John M. Cotte , Hariklia Deligianni , Mahadevaiyer Krishnan , Wei-Tsu Tseng , Philippe M. Vereecken
- 申请人： Panayotis C. Andricacos , Shyng-Tsong Chen , John M. Cotte , Hariklia Deligianni , Mahadevaiyer Krishnan , Wei-Tsu Tseng , Philippe M. Vereecken
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Connolly, Bove, Lodge & Hutz, LLP
- 代理商 Robert Trepp
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L29/40
摘要：
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.
公开/授权文献
- US20060076685A1 Selective capping of copper wiring 公开/授权日：2006-04-13
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