利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US07190286B2 Single-stage and multi-stage low power interconnect architectures 有权
单级和多级低功率互连架构

Single-stage and multi-stage low power interconnect architectures
摘要：
An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.
摘要（中）：

提供互连架构以降低功耗。 第一驱动器可以在第一互连上驱动信号，并且第二驱动器可以在第二互连上驱动信号。 第一驱动器可以由第一电压供电，并且第二驱动器可以由不同于第一电压的第二电压供电。

公开/授权文献
信息查询
Espacenet
0/0