发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US10283076申请日： 2002-10-30
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公开(公告)号： US07193329B2公开(公告)日： 2007-03-20
- 发明人: Norio Takahashi
- 申请人： Norio Takahashi
- 申请人地址： JP Tokyo
- 专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Volentine & Whitt, P.L.L.C.
- 优先权： JP2002-003145 20020110
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The semiconductor device includes a tabular base metal having an insulating layer provided on a bottom surface thereof, and the insulating layer includes a plurality of wiring patterns, each of which is provided with a connecting pad at one end thereof. A semiconductor chip is adhered at a substantial center of the insulating layer with an adhesive. Electrodes provided on a bottom surface of the semiconductor chip are connected to the other ends of the wiring patterns by wire bonding via wires. The semiconductor chip is molded with a resin. The connecting pads are connected to solder balls via an interposer substrate provided with conductors.
公开/授权文献
- US20030127737A1 Semiconductor device 公开/授权日：2003-07-10
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