Invention Grant
US07199469B2 Semiconductor device having stacked semiconductor chips sealed with a resin seal member
失效
具有用树脂密封构件密封的层叠半导体芯片的半导体装置
- Patent Title: Semiconductor device having stacked semiconductor chips sealed with a resin seal member
- Patent Title (中): 具有用树脂密封构件密封的层叠半导体芯片的半导体装置
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Application No.: US09964484Application Date: 2001-09-28
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Publication No.: US07199469B2Publication Date: 2007-04-03
- Inventor: Toru Ishida , Tetsuharu Urawa , Fujio Ito , Tomoo Matsuzawa , Kazunari Suzuki , Akihiko Kameoka , Hiromichi Suzuki , Takuji Ide
- Applicant: Toru Ishida , Tetsuharu Urawa , Fujio Ito , Tomoo Matsuzawa , Kazunari Suzuki , Akihiko Kameoka , Hiromichi Suzuki , Takuji Ide
- Applicant Address: JP Tokyo JP Tokyo JP Hokkaido
- Assignee: Renesas Technology Corp.,Hitachi ULSI Systems Co., Ltd.,Hitachi Hokkai Semiconductor, Ltd.
- Current Assignee: Renesas Technology Corp.,Hitachi ULSI Systems Co., Ltd.,Hitachi Hokkai Semiconductor, Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo JP Hokkaido
- Agency: Mattingly, Stanger, Malur & Brundidge, P.C.
- Priority: JP2000-315785 20001016
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495 ; H01L23/50 ; H01L25/18 ; H01L25/065
Abstract:
The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
Public/Granted literature
- US20020043717A1 Semiconductor device Public/Granted day:2002-04-18
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