公开(公告)号：US07199469B2

公开(公告)日：2007-04-03

申请号：US09964484

申请日：2001-09-28

申请人： Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

发明人： Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L25/18 ,  H01L25/065

CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012

摘要： The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.

摘要翻译： 降低半导体器件的成本。 通过布置在第一半导体芯片周围的引线的引线的内部引线部分和两个接合线来制造堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片之间的电连接。

公开(公告)号：US06610788B1

公开(公告)日：2003-08-26

申请号：US09763148

申请日：2001-02-20

申请人： Teruo Takakura ,  Toru Ishida ,  Naomi Ichikuni

发明人： Teruo Takakura ,  Toru Ishida ,  Naomi Ichikuni

IPC分类号： C08F25908

CPC分类号： C09D127/18 ,  C08F259/08 ,  C08L33/06 ,  C09D127/12 ,  C08L2666/04

摘要： An aqueous dispersion of a fluorocopolymer, which is excellent in stability and film-forming properties as an aqueous dispersion and which gives a coating film excellent in weather resistance and mechanical strength and improved in water resistance and stain resistance. The aqueous dispersion comprises water and dispersed therein a fluorocopolymer which comprises (a) polymer units based on a fluoroolefin, (b) polymer units based on propylene, (c) polymer units based on ethylene and/or (d) polymer units based on butylene and which has a melting point within a range of from 40 to 150° C.

摘要翻译： 含氟共聚物的水性分散体，其作为水性分散体的稳定性和成膜性优异，并且具有优异的耐候性和机械强度以及耐水性和耐污渍性提高的涂膜。 水分散体包含水并分散在其中的含氟共聚物，其包含（a）基于氟烯烃的聚合物单元，（b）基于丙烯的聚合物单元，（c）基于乙烯的聚合物单元和/或（d）基于丁烯的聚合物单元 其熔点在40-150℃的范围内。

公开(公告)号：US5406459A

公开(公告)日：1995-04-11

申请号：US939000

申请日：1992-09-02

申请人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

发明人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/16

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K3/28 ,  H05K3/305 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623

摘要： An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.

摘要翻译： 一种电路板模块，包括其一侧安装有电气部件的基板和设置在其另一侧上的电极，用于与所安装的电气部件的电连接。 电路板模块还包括粘附到电极的导体柱和设置在基板的另一侧上并围绕导体柱的粘合层，使得导体列从粘合层挤出预定长度。 通过将电路板模块压靠在单独的电路板上以安装在其上，电气部件通过导体柱与工作电路板的电极电连接。 由于导体柱由分散有金属粉末的树脂浆料制成，因此不需要使用焊料流动的常规模块中的加热操作，导致电子部件不受热引起的劣化。

公开(公告)号：US4714570A

公开(公告)日：1987-12-22

申请号：US756081

申请日：1985-07-17

申请人： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

发明人： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

IPC分类号： C04B41/51 ,  H01B1/20 ,  H01L21/48 ,  H01L23/482 ,  H05K1/09 ,  H01B1/06

CPC分类号： H05K1/092 ,  C04B41/5127 ,  C04B41/5144 ,  H01B1/20 ,  H01L21/4867 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

摘要： A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

摘要翻译： 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法和以CuO，NiO，CoO或Fe2O3为特征的导体形成膏作为主要成分，将该糊状物施加到多层 身体。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。

公开(公告)号：US4695403A

公开(公告)日：1987-09-22

申请号：US875083

申请日：1986-06-17

申请人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Toru Ishida

发明人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Toru Ishida

IPC分类号： C04B41/51 ,  C04B41/88 ,  H01B1/16 ,  H01L23/498 ,  H05K1/09 ,  H01B1/00

CPC分类号： C04B41/88 ,  C04B41/5127 ,  H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

摘要： A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.

摘要翻译： 用于陶瓷布线基板的厚膜导体组合物包括主要由添加有能够形成具有铜的均匀固溶体的金属的氧化铜粉末和有机载体的无机成分。 无机成分还可以添加氧化锰或耐热绝缘材料如陶瓷和/或玻璃。

公开(公告)号：US20110046940A1

公开(公告)日：2011-02-24

申请号：US12866657

申请日：2009-01-15

申请人： Rie Tanaka ,  Toru Ishida ,  Yohei Murakami

发明人： Rie Tanaka ,  Toru Ishida ,  Yohei Murakami

IPC分类号： G06F17/28

CPC分类号： G06F17/289

摘要： A machine translation device includes: an accepting portion that accepts a first-language document; storage portion in which are stored one or more pieces of multilingual parallel translation information that are each a set of synonymous words in the first language through the Nth language (N is 3 or more integer); a selecting portion that selects the multilingual parallel translation information including a word included in an ith-language document (i is an integer of 1 to N-1) from the one or more pieces of multilingual parallel translation information; a machine translation portion that repeats processing of machine translating the ith-language document into an (i+1)th language document until machine translation into the Nth language has been performed, so as to use parallel-translation relation between two languages included in the selected multilingual parallel translation information; and an output portion that outputs the Nth-language document.

摘要翻译： 机器翻译装置包括：接收第一语言文档的接收部分; 存储部分，其中存储一个或多个多语言并行翻译信息，每个多语言并行翻译信息是通过第N种语言（N为3或更多整数）的第一语言的一组同义词。 选择部分，从所述一个或多个多语言并行翻译信息中选择包括第i-language文档中包含的单词（i为1到N-1的整数）的多语言并行翻译信息; 重复机器翻译部分，其重复处理将第i语言文档翻译成第（i + 1）语言文档的机器，直到机器翻译成第N种语言为止，以便使用包括在第i语言文档中的两种语言之间的并行翻译关系 选择多语言并行翻译信息; 以及输出第N语言文档的输出部分。

公开(公告)号：US5014111A

公开(公告)日：1991-05-07

申请号：US279101

申请日：1988-12-02

申请人： Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

发明人： Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

IPC分类号： H01L21/607 ,  H01L23/485

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49149 ,  Y10T29/49151

摘要： A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

公开(公告)号：US4943666A

公开(公告)日：1990-07-24

申请号：US337886

申请日：1989-04-14

申请人： Taiiti Okada ,  Toru Ishida

发明人： Taiiti Okada ,  Toru Ishida

IPC分类号： C07C201/08 ,  C07C67/00 ,  C07C201/00 ,  C07C205/26

CPC分类号： C07C201/08

摘要： An improved industrial process for producing a compound of the general formula: ##STR1## wherein R is an alkyl group having 1 to 4 carbon atoms which comprises reacting a compound of the general formula: ##STR2## wherein R is as defined above with nitrous acid in a mixed solvent of water and a water-insoluble or slightly soluble organic solvent.

公开(公告)号：US4863683A

公开(公告)日：1989-09-05

申请号：US66182

申请日：1987-06-24

申请人： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

发明人： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

IPC分类号： C04B41/51 ,  H01B1/20 ,  H01L21/48 ,  H01L23/482 ,  H05K1/09

CPC分类号： H05K1/092 ,  C04B41/5127 ,  C04B41/5144 ,  H01B1/20 ,  H01L21/4867 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

摘要： A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

摘要翻译： 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法，以CuO，NiO，CoO或Fe2O3为特征的导体形成膏为主要成分，将该糊剂涂敷于多层体 。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。

公开(公告)号：US4732798A

公开(公告)日：1988-03-22

申请号：US898892

申请日：1986-08-21

申请人： Toru Ishida ,  Yasuharu Kikuchi ,  Tatsurou Kikuchi ,  Yasuhiko Horio

发明人： Toru Ishida ,  Yasuharu Kikuchi ,  Tatsurou Kikuchi ,  Yasuhiko Horio

IPC分类号： H05K3/46 ,  H01L21/70 ,  H01L23/538 ,  H05K1/03 ,  H05K1/16 ,  H05K3/24 ,  H05K3/40 ,  B32B3/00

CPC分类号： H05K3/4061 ,  H01L21/705 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/035 ,  H05K3/248 ,  H05K3/4629 ,  H05K3/4667 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917

摘要： The present invention relates to a base metal conductor multilayered substrate capable of being integral with thick film components such as thick film resistors and to a method for producing such substrate.

摘要翻译： 本发明涉及能够与厚膜电阻等厚膜成分一体化的母金属导体多层基板及其制造方法。