Invention Grant
- Patent Title: Interconnecting of digital devices
- Patent Title (中): 数字设备互连
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Application No.: US10126754Application Date: 2002-04-19
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Publication No.: US07199681B2Publication Date: 2007-04-03
- Inventor: Rajeevan Amirtharajah , John R. Benham , John L. Critchlow , Thomas D. Simon , Mark E. Naylor
- Applicant: Rajeevan Amirtharajah , John R. Benham , John L. Critchlow , Thomas D. Simon , Mark E. Naylor
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H03H7/38
- IPC: H03H7/38

Abstract:
In some embodiments, a first conducting line, having a characteristic impedance, connects to a digital device while a second conducting line, also having a characteristic impedance, connects to another digital device. An impedance pathway connects the two conducting lines and has an impedance of at least one-third of the first conducting line's characteristic impedance and of at least one-third of the second conducting line's characteristic impedances. Other embodiments are claimed.
Public/Granted literature
- US20030200346A1 Interconnecting of digital devices Public/Granted day:2003-10-23
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