Invention Grant
- Patent Title: Suspension for filling via holes in silicon and method for making the same
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Application No.: US10707693Application Date: 2004-01-05
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Publication No.: US07202154B2Publication Date: 2007-04-10
- Inventor: Jon A. Casey , Brian R. Sundlof
- Applicant: Jon A. Casey , Brian R. Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLio & Peterson, LLC
- Agent Robert Curcio; Ira D. Blecker
- Main IPC: H01L21/4763
- IPC: H01L21/4763

Abstract:
A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes in the silicon with the paste or suspension. The suspensions sinter with minimal bulk shrinkage, forming highly conductive structures without the formation of macroscopic voids. The selected suspension maintains a coefficient of thermal expansion closer to that of silicon.
Public/Granted literature
- US20050148164A1 A SUSPENSION FOR FILLING VIA HOLES IN SILICON AND METHOD FOR MAKING THE SAME Public/Granted day:2005-07-07
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