The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.