Invention Grant
- Patent Title: Method and apparatus for improved power routing
- Patent Title (中): 改善电力布线的方法和装置
-
Application No.: US11144974Application Date: 2005-06-03
-
Publication No.: US07208402B2Publication Date: 2007-04-24
- Inventor: Mark T. Bohr , Robert W. Martell
- Applicant: Mark T. Bohr , Robert W. Martell
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Cyndi M. Wheeler
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/4763 ; H01L29/40
Abstract:
An apparatus comprising: a die having a top metal layer, the top metal layer comprised of at least a first metal line and a second metal line; a passivation layer covering the top metal layer; a C4 bump on the passivation layer; and a first passivation opening and a second passivation opening in the passivation layer, the first passivation opening to connect the first metal line to the C4 bump, and the second passivation opening to connect the second metal line to the C4 bump.
Public/Granted literature
- US20050233570A1 Method and apparatus for improved power routing Public/Granted day:2005-10-20
Information query
IPC分类:
