Invention Grant
- Patent Title: Semiconductor device with strain relieving bump design
- Patent Title (中): 具有应变消除凸块设计的半导体器件
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Application No.: US10909124Application Date: 2004-07-30
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Publication No.: US07208841B2Publication Date: 2007-04-24
- Inventor: James Jen-Ho Wang , Jin-Wook Jang , Alfredo Mendoza , Rajashi Runton , Russell Shumway
- Applicant: James Jen-Ho Wang , Jin-Wook Jang , Alfredo Mendoza , Rajashi Runton , Russell Shumway
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Agency: Fortkort & Houston P.C.
- Agent John A. Fortkort
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H05K1/00

Abstract:
A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.
Public/Granted literature
- US20050023680A1 Semiconductor device with strain relieving bump design Public/Granted day:2005-02-03
Information query
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