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Invention Grant
US07208841B2 Semiconductor device with strain relieving bump design 有权
具有应变消除凸块设计的半导体器件

Semiconductor device with strain relieving bump design
Abstract:
A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.
Abstract(Chinese):

提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。

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