公开(公告)号：US20110163439A1

公开(公告)日：2011-07-07

申请号：US12683961

申请日：2010-01-07

Applicant: Jin-Wook Jang ,  Lalgudi M. Mahalingam ,  Audel A. Sanchez ,  Lakshminarayan Viswanathan

Inventor： Jin-Wook Jang ,  Lalgudi M. Mahalingam ,  Audel A. Sanchez ,  Lakshminarayan Viswanathan

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L23/373 ,  H01L23/057 ,  H01L23/3731 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0489 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method includes providing a silicon-containing die and providing a heat sink having a palladium layer over a first surface of the heat sink. A first gold layer is located over one of a first surface of the die or the palladium layer. The silicon-containing die is bonded to the heat sink, where bonding includes joining the silicon-containing die and the heat sink such that the first gold layer and the palladium layer are between the first surface of the silicon-containing die and the first surface of the heat sink, and heating the first gold layer and the palladium layer to form a die attach layer between the first surface of the silicon-containing die and the first surface of the heat sink, the die attach layer comprising a gold interface layer having a plurality of intermetallic precipitates, each of the plurality of intermetallic precipitates comprising palladium, gold, and silicon.

Abstract translation: 一种方法包括提供含硅模头并且在散热器的第一表面上提供具有钯层的散热器。 第一金层位于管芯的第一表面或钯层之一上。 所述含硅芯片与所述散热器接合，其中，所述接合包括将所述含硅芯片与所述散热器接合，使得所述第一金层和所述钯层位于所述含硅模具的所述第一表面和所述第一表面之间 并且加热所述第一金层和所述钯层以在所述含硅芯片的所述第一表面和所述散热器的所述第一表面之间形成管芯附着层，所述管芯附着层包括金界面层，所述金界面层具有 多个金属间化合物沉淀物，多个金属间析出物中的每一个包括钯，金和硅。

公开(公告)号：US20100054949A1

公开(公告)日：2010-03-04

申请号：US12430235

申请日：2009-04-27

Applicant: Jin-Wook Jang ,  Yong-Taek Hwang ,  Young-Seok Choi ,  Kyoung-Yong Lee ,  Uk-Hee Jeong ,  Murase Seiji

Inventor： Jin-Wook Jang ,  Yong-Taek Hwang ,  Young-Seok Choi ,  Kyoung-Yong Lee ,  Uk-Hee Jeong ,  Murase Seiji

IPC: F04D29/18

CPC classification number: F04D5/002 ,  F04D29/188 ,  F04D29/669

Abstract: A random pitch impeller for a fuel pump has number of blades. An incremental angle of the blades is set by the expression: Δθ   i = ( 360 N ) + ( - 1 ) i × Am × sin  ( p 1 × 360 N × i )  cos  ( P 2 × 360 N × i ) , where ΔθI is the incremental angle between the blades, N is the total number of blades (N=2, 3, 5, 7, 11, 13, 17, . . . ), Am is the distribution magnitude of the inter-blade interval (equally divided angle) (0

Abstract translation: 用于燃料泵的随机桨距叶轮具有多个叶片。 叶片的增量角度由以下表达式设置：＆Dgr;＆thetas; （360 N）+（ - 1）i×Am×sin（p 1×360 N×i）cos（P 2×360 N×i），其中＆Dgr;＆Theta; I是增量 叶片之间的角度，N是叶片的总数（N = 2,3,5,7,11,13,17，...），Am是叶片间间隔的分布幅度（等分角） （0

公开(公告)号：US07208841B2

公开(公告)日：2007-04-24

申请号：US10909124

申请日：2004-07-30

Applicant: James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

Inventor： James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00

CPC classification number: H01L24/16 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/081 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00012

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Abstract translation: 提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。

公开(公告)号：US07041635B2

公开(公告)日：2006-05-09

申请号：US10353753

申请日：2003-01-28

Applicant: Hun-Taek Kim ,  In-Young Song ,  Jae Won Choi ,  Jin-Wook Jang ,  Yong-Kook Kim ,  Ho Soon Lee ,  Yung-Jue Bang ,  Dae-Kee Kim

Inventor： Hun-Taek Kim ,  In-Young Song ,  Jae Won Choi ,  Jin-Wook Jang ,  Yong-Kook Kim ,  Ho Soon Lee ,  Yung-Jue Bang ,  Dae-Kee Kim

IPC: A61K35/14 ,  A61K35/16 ,  A61K38/00

CPC classification number: C07K14/755 ,  A61K48/00 ,  Y10S514/802 ,  Y10S514/834 ,  Y10S930/10

Abstract: The application discloses Factor VIII polypeptides comprising internal deletions of amino acids within the area of residues 741 to 1689, wherein the thrombin cleavage sites at about 741 and about 1689 are present, and a site at about 1648 is not present, as compared to human Factor VIII.

Abstract translation: 该应用公开了包含在残基741至1689的区域内的氨基酸的内部缺失的因子VIII多肽，其中存在约741和约1689的凝血酶切割位点，并且与人因子相比不存在约1648位点 八，

公开(公告)号：US20130273101A1

公开(公告)日：2013-10-17

申请号：US13995188

申请日：2011-12-17

Applicant: Yang Je Cho ,  Na Gyong Lee ,  Jin Wook Jang ,  Kwang Sung Kim ,  Won Il Yoo

Inventor： Yang Je Cho ,  Na Gyong Lee ,  Jin Wook Jang ,  Kwang Sung Kim ,  Won Il Yoo

IPC: A61K39/39 ,  A61K39/07 ,  A61K39/29 ,  A61K39/25 ,  A61K39/145 ,  A61K39/245 ,  A61K39/095 ,  A61K39/00 ,  A61K39/04 ,  A61K39/21

CPC classification number: A61K39/39 ,  A61K39/0018 ,  A61K39/04 ,  A61K39/07 ,  A61K39/095 ,  A61K39/102 ,  A61K39/145 ,  A61K39/21 ,  A61K39/245 ,  A61K39/25 ,  A61K39/29 ,  A61K39/292 ,  A61K2039/55572 ,  C12N2710/16634 ,  C12N2710/16734 ,  C12N2730/10134 ,  C12N2740/16034 ,  C12N2760/16134

Abstract: The present invention relates to a pharmaceutical vaccine composition comprising: (a) a pathogen-derived antigen selected from the group consisting of Mycobacterium tuberculosis antigen, Bacillus anthracis antigen, HAV (hepatitis A virus) antigen, HBV (hepatitis B virus) antigen, HCV (hepatitis C virus) antigen, HIV (human immunodeficiency virus) antigen, influenza virus antigen, HSV (herpes simplex virus) antigen, Hib (Haemophilus influenzae type b) antigen, Neisseria meningitidis antigen, Corynebacterium diphtheriae antigen, Bordetella pertussis antigen, Clostridium tetani antigen and Varicella virus antigen; (b) a deacylated non-toxic LOS (lipooligosaccharide); and (c) a pharmaceutically acceptable carrier.

Abstract translation: 本发明涉及药物疫苗组合物，其包含：（a）选自结核分枝杆菌抗原，炭疽芽孢杆菌抗原，HAV（甲型肝炎病毒）抗原，HBV（乙型肝炎病毒）抗原，HCV的病原体衍生抗原 （丙型肝炎病毒）抗原，HIV（人类免疫缺陷病毒）抗原，流感病毒抗原，HSV（单纯疱疹病毒）抗原，Hib（流感嗜血杆菌b型）抗原，脑膜炎奈瑟氏球菌抗原，白喉棒状杆菌抗原，百日咳博德特氏菌抗原， 抗原和水痘病毒抗原; （b）脱酰无毒LOS（脂寡糖）; 和（c）药学上可接受的载体。

公开(公告)号：US08372811B2

公开(公告)日：2013-02-12

申请号：US12678898

申请日：2007-09-21

Applicant: Jin Wook Jang ,  Hyeong Joon Lim ,  Yang Je Cho ,  Won Il Yoo ,  Doo Sik Kim ,  Oh Woong Kwon ,  Kyoung Chul Ko ,  Kyung Sul Kim

Inventor： Jin Wook Jang ,  Hyeong Joon Lim ,  Yang Je Cho ,  Won Il Yoo ,  Doo Sik Kim ,  Oh Woong Kwon ,  Kyoung Chul Ko ,  Kyung Sul Kim

IPC: C07K14/515 ,  A61K38/00

CPC classification number: A61K38/4833

Abstract: Disclosed is a composition for treating retinopathy comprising thrombin derived peptide as an effective component.

Abstract translation: 公开了用于治疗视网膜病变的组合物，其包含凝血酶衍生肽作为有效成分。

公开(公告)号：US08252631B1

公开(公告)日：2012-08-28

申请号：US13096269

申请日：2011-04-28

Applicant: Jin-Wook Jang ,  Shun Meen Kuo

Inventor： Jin-Wook Jang ,  Shun Meen Kuo

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L23/49513 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83855 ,  H01L2224/8392 ,  H01L2224/83948 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and device are disclosed in which a a lead-free or low-lead die attach material is applied to a surface. An electronic die is positioned on the die attach material. An oxide of at least a specified thickness is formed over an exposed portion of the die attach material. Wire bonds are formed between the electronic die and the surface, and an encapsulant material is applied over the surface, the oxide, and the electronic die.

Abstract translation: 公开了一种方法和装置，其中将无铅或低引线芯片附接材料施加到表面。 电子管芯位于管芯附着材料上。 至少指定厚度的氧化物形成在芯片附着材料的暴露部分上。 在电子管芯和表面之间形成引线键，并且将密封剂材料施加在表面，氧化物和电子管芯上。

公开(公告)号：US20060270194A1

公开(公告)日：2006-11-30

申请号：US11140351

申请日：2005-05-26

Applicant: Vasile Thompson ,  Jason Fender ,  Terry Daly ,  Jin-Wook Jang

Inventor： Vasile Thompson ,  Jason Fender ,  Terry Daly ,  Jin-Wook Jang

IPC: H01L21/00 ,  H01L23/52

CPC classification number: H01L23/482 ,  H01L23/481 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10158 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15763 ,  H01L2924/01031 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/00

Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) during the die attachment process and methods for fabricating the same are provided. A method in accordance with the invention comprises providing a semiconductor wafer stack (110) including a plurality of metal pads (112). An adhesion/plating layer (115) is formed on a surface (119) of a substrate (116). A layer of gold (118) is plated on a surface of the adhesion/plating layer (115). The layer of gold is etched in a street area (124) using standard photolithography techniques to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edges (128) of the layer of gold (118) the adhesion/plating layer (115). The semiconductor wafer stack (110) is diced in the street area (124) and soldered to a leadframe (162) to form a semiconductor package (100) that provides for an edge seal (128) to prevent the leaching of gold from back metal layers (118) into the solder (162).

Abstract translation: 提供了防止在模具附接过程期间将金从后金属层（118）浸入焊料（164）中的半导体封装（100）及其制造方法。 根据本发明的方法包括提供包括多个金属焊盘（112）的半导体晶片堆叠（110）。 在基板（116）的表面（119）上形成粘合/镀层（115）。 将金层（118）镀在粘合/镀层（115）的表面上。 使用标准光刻技术在街道区域（124）中蚀刻金层，以暴露金层（118）和粘附/镀层（115）的边缘部分（128）。 沉积一层阻挡金属（130），以形成围绕粘合/镀层（115）的金层（118）的暴露边缘（128）的边缘密封（129）。 半导体晶片堆叠（110）在街道区域（124）中切割并焊接到引线框架（162）以形成提供边缘密封（128）以防止金从背面金属浸出的半导体封装（100） 层（118）进入焊料（162）。

公开(公告)号：US20050023680A1

公开(公告)日：2005-02-03

申请号：US10909124

申请日：2004-07-30

Applicant: James Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

Inventor： James Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/52

CPC classification number: H01L24/16 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/081 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00012

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Abstract translation: 提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。

公开(公告)号：US20160086898A1

公开(公告)日：2016-03-24

申请号：US14722742

申请日：2015-05-27

Applicant: Jin-wook Jang ,  Se-jin Yoo ,  Sung-il Cho ,  Jae-ho Choi

Inventor： Jin-wook Jang ,  Se-jin Yoo ,  Sung-il Cho ,  Jae-ho Choi

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L24/09 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/8192 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/014

Abstract: A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.

Abstract translation: 半导体封装包括：包括多个焊盘的布线基板; 芯片，其包括通过多个焊料连接到焊盘的多个芯片焊盘; 密封层，其被构造成密封所述芯片和所述焊料，所述至少一个空隙在所述焊料之间; 以及在由所述至少一个空隙暴露的所述焊料的一个侧壁上的焊料挤出防止层。