公开(公告)号：US20070234285A1

公开(公告)日：2007-10-04

申请号：US11364621

申请日：2006-02-28

申请人： Alfredo Mendoza ,  Chakarat Skawratananond

发明人： Alfredo Mendoza ,  Chakarat Skawratananond

IPC分类号： G06F9/44 ,  G06F9/45

CPC分类号： G06F8/51

摘要： Providing the developer porting an application program from a source operating system platform to a target operating system platform with a list of API functions supported by the source operating system platform on which the application program is running but unsupported by the target platform. The implementation includes generating a list of interface functions in said application program supported by the source platform and comparing this list of source supported application program functions with a list of prototype application program functions supported by the target platform. As a result of the comparison, there is generated an output list of the application program interface functions supported by said source platform but unsupported by said target platform.

摘要翻译： 提供开发人员将应用程序从源操作系统平台移植到目标操作系统平台，其中包含运行应用程序但不受目标平台支持的源操作系统平台支持的API功能列表。 实现包括在由源平台支持的所述应用程序中生成接口功能的列表，并将源支持的应用程序功能列表与目标平台支持的原型应用程序功能的列表进行比较。 作为比较的结果，生成由所述源平台支持但不受所述目标平台支持的应用程序接口功能的输出列表。

公开(公告)号：US20050188345A1

公开(公告)日：2005-08-25

申请号：US10782500

申请日：2004-02-19

申请人： Kyusun Chang ,  Jagadish Dasari ,  Hari Madduri ,  Alfredo Mendoza ,  John Mims

发明人： Kyusun Chang ,  Jagadish Dasari ,  Hari Madduri ,  Alfredo Mendoza ,  John Mims

IPC分类号： G06F9/44 ,  G06F9/445

CPC分类号： G06F8/20 ,  G06F8/60

摘要： An example of a solution provided here comprises assessing readiness for transformation, based on a number of desirable application attributes; planning development work (which may involve mapping desirable application attributes to kinds of help); generating a proposal for transformation, and outputting the proposal.

摘要翻译： 这里提供的解决方案的一个例子包括基于许多期望的应用属性评估转换的准备状态; 规划开发工作（可能涉及将所需的应用程序属性映射到各种帮助）; 生成转型提案，并输出提案。

公开(公告)号：US20050023680A1

公开(公告)日：2005-02-03

申请号：US10909124

申请日：2004-07-30

申请人： James Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

发明人： James Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/52

CPC分类号： H01L24/16 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/081 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00012

摘要： A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

摘要翻译： 提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。

公开(公告)号：US07208841B2

公开(公告)日：2007-04-24

申请号：US10909124

申请日：2004-07-30

申请人： James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

发明人： James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00

CPC分类号： H01L24/16 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/081 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00012

摘要： A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

摘要翻译： 提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。

公开(公告)号：US20070220348A1

公开(公告)日：2007-09-20

申请号：US11364650

申请日：2006-02-28

申请人： Alfredo Mendoza ,  Stephen Peckham ,  Clifford Spinac ,  Tiffany Winman

发明人： Alfredo Mendoza ,  Stephen Peckham ,  Clifford Spinac ,  Tiffany Winman

IPC分类号： G06F11/00

CPC分类号： G06F11/3612

摘要： A computer implemented method, computer program product, and computer usable program code for preventing execution of program components having errors. First, a software application is executed. The software application interacts with a number of programs. Next, an error message is received. The error message indicates an error has occurred in a first program within the number of programs. The first program is then isolated such that the first program no longer interacts with the software application.

摘要翻译： 计算机实现的方法，计算机程序产品和用于防止执行具有错误的程序组件的计算机可用程序代码。 首先，执行软件应用程序。 软件应用程序与许多程序进行交互。 接下来，接收到错误消息。 该错误消息表示在程序数量内的第一个程序中发生错误。 然后隔离第一个程序，使得第一个程序不再与软件应用程序交互。

公开(公告)号：US20070038708A1

公开(公告)日：2007-02-15

申请号：US11201646

申请日：2005-08-11

申请人： Balaji Atyam ,  Franck Barillaud ,  Matthew Cali ,  Anita Govindjee ,  Alfredo Mendoza

发明人： Balaji Atyam ,  Franck Barillaud ,  Matthew Cali ,  Anita Govindjee ,  Alfredo Mendoza

IPC分类号： G06F15/16

CPC分类号： G06Q10/107

摘要： Sending E-Mail including the conventional implementation enabling the sender of an electronic mail document to specify users to receive the document; but, in addition, the process invites the sender creating the E-Mail to prompt the sender with more potential recipients as the sender, proceeds with the creation of the E-Mail message. An address book is maintained including the E-Mail addresses of a set of names of selected recipients who regularly receive E-Mail from the sender. Then, there is monitoring the text being entered for words with initial capital letters combined with an implementation responsive to the monitoring for determining if a located word with an initial capital corresponds to a name in said address book. The corresponding name to the designated recipients of the E-Mail message provided the sender interactively agrees to do so. Optionally, the system may be set up so the monitoring is for two consecutive words with initial capitals corresponding to the first and last name of a recipient in said address book.

摘要翻译： 发送电子邮件，包括允许电子邮件文档的发送者指定用户接收文档的常规实现; 但是，此外，该过程还邀请发件人创建电子邮件以提示具有更多潜在收件人的发件人作为发件人，继续创建电子邮件。 维护一个通讯录，包括定期从发件人接收电子邮件的所选收件人的一组名称的电子邮件地址。 然后，正在监视正在输入的文本，其中带有初始大写字母的单词与响应于监视的实现结合，以确定具有初始资本的定位词是否对应于所述地址簿中的名称。 电子邮件消息的指定收件人的相应名称提供给发件人交互式同意这样做。 可选地，可以设置系统，使得监视是针对两个连续的字，其中初始资本对应于所述地址簿中的接收者的姓氏和姓氏。

公开(公告)号：US20060069621A1

公开(公告)日：2006-03-30

申请号：US10922275

申请日：2004-08-19

申请人： Kyusun Chang ,  Jagadish Dasari ,  John Falkl ,  Alfredo Mendoza

发明人： Kyusun Chang ,  Jagadish Dasari ,  John Falkl ,  Alfredo Mendoza

IPC分类号： G06Q30/00

CPC分类号： G06F9/505 ,  G06F9/5072 ,  G06F2209/5015 ,  G06F2209/508 ,  G06Q30/0207 ,  G06Q30/0601 ,  G06Q30/08 ,  G06Q40/04

摘要： A system for allocating resources which are anticipated to be available in an on-demand computing at some time in the future, wherein a producer trending agent (PTA) lists resources according to a trend prediction of resource availability in the past, a consumer trending agent (CTA) places bids for listed resources according to previous resource usage trends, and an arbitration system (REAS) matches the bids with the listings to determine if a match exists. If so, a binding contract for consumption of the matched listed resources is established. The PTA also produce tier-based dynamic incentive (TDI) schema which divides potential bidders into tiers, and offers additional resource incentives according to the tiers. Both PTA and CTA dynamically update their available/usage trends, listings and bids, over time.

公开(公告)号：US06790759B1

公开(公告)日：2004-09-14

申请号：US10631102

申请日：2003-07-31

申请人： James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

发明人： James Jen-Ho Wang ,  Jin-Wook Jang ,  Alfredo Mendoza ,  Rajashi Runton ,  Russell Shumway

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/081 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00012

摘要： A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

摘要翻译： 提供半导体器件（51）。 所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分 （63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。 优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力 在基板（69）和模具（53）之间。 容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。