A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.