发明授权
- 专利标题： Interlevel dielectric layer and metal layer sealing
- 专利标题（中）： 层间电介质层和金属层密封
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申请号： US10710706申请日： 2004-07-29
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公开(公告)号： US07214608B2公开(公告)日： 2007-05-08
- 发明人: Matthew S. Angyal , Peter E. Biolsi , Lawrence A. Clevenger , Habib Hichri , Bernd E. Kastenmeier , Michael W. Lane , Jeffrey R. Marino , Vincent J. McGahay , Theodorus E. Standaert
- 申请人： Matthew S. Angyal , Peter E. Biolsi , Lawrence A. Clevenger , Habib Hichri , Bernd E. Kastenmeier , Michael W. Lane , Jeffrey R. Marino , Vincent J. McGahay , Theodorus E. Standaert
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Hoffman, Warnick & D'Alessandro LLC
- 代理商 Lisa U. Jaklitsch
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
Methods for sealing an organic ILD layer and a metal layer after an etching step. The method includes etching through an ILD layer and leaving a remaining portion of an underlying metal layer cap, maintaining the device in an inert gas, and depositing at least a portion of a liner into the opening to seal the ILD layer and the metal layer. Subsequent processing may include formation of a via by etching through the portion of the liner and the remaining portion of the cap layer, and depositing a metal.
公开/授权文献
- US20060024961A1 INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING 公开/授权日：2006-02-02
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