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发明授权
US07215026B2 Semiconductor module and method of forming a semiconductor module 有权
半导体模块和形成半导体模块的方法

Semiconductor module and method of forming a semiconductor module
摘要：
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要（中）：

在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。 此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。 例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

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