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12 条记录 (耗时 0.032 秒)

    Heat spreader, semiconductor package module and memory module having the heat spreader
    5.
    发明授权
    Heat spreader, semiconductor package module and memory module having the heat spreader 有权
    散热器，半导体封装模块和具有散热器的存储模块

    公开(公告)号：US07518873B2

    公开(公告)日：2009-04-14

    申请号：US11481179

    申请日：2006-07-06

    申请人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    发明人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

    摘要翻译： 散热器包括散热板和压力夹。 散热板将热量从热源辐射出来。 压力夹将散热板固定在热源上。 压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。 脊柱布置在散热板上。 一个或多个肋从脊部延伸并接触热源。 钩部分从脊柱延伸并由热源支撑。 压力夹还包括将脊柱连接到钩部件的安装部件。 在脊柱和散热板之间形成弯曲空间。 散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

    Heat spreader, semiconductor package module and memory module having the heat spreader
    6.
    发明申请
    Heat spreader, semiconductor package module and memory module having the heat spreader 有权
    散热器，半导体封装模块和具有散热器的存储模块

    公开(公告)号：US20070008703A1

    公开(公告)日：2007-01-11

    申请号：US11481179

    申请日：2006-07-06

    申请人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    发明人： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

    摘要翻译： 散热器包括散热板和压力夹。 散热板将热量从热源辐射出来。 压力夹将散热板固定在热源上。 压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。 脊柱布置在散热板上。 一个或多个肋从脊部延伸并接触热源。 钩部分从脊柱延伸并由热源支撑。 压力夹还包括将脊柱连接到钩部件的安装部件。 在脊柱和散热板之间形成弯曲空间。 散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

    SEMICONDUCTOR PACKAGE AND MODULE PRINTED CIRCUIT BOARD FOR MOUNTING THE SAME
    8.
    发明申请
    SEMICONDUCTOR PACKAGE AND MODULE PRINTED CIRCUIT BOARD FOR MOUNTING THE SAME 有权
    半导体封装和模块印刷电路板，用于安装它们

    公开(公告)号：US20080157389A1

    公开(公告)日：2008-07-03

    申请号：US11968035

    申请日：2007-12-31

    申请人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    发明人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    IPC分类号： H01L23/48 ,  H05K7/02

    CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

    摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.

    摘要翻译： 提供了用于安装它的半导体封装和模块印刷电路板（PCB）。 半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。 第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。 第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。 第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。 在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

    Semiconductor package and module printed circuit board for mounting the same
    9.
    发明授权
    Semiconductor package and module printed circuit board for mounting the same 有权
    半导体封装和模块印刷电路板用于安装

    公开(公告)号：US07675176B2

    公开(公告)日：2010-03-09

    申请号：US11968035

    申请日：2007-12-31

    申请人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    发明人： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

    摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.

    摘要翻译： 提供了用于安装它的半导体封装和模块印刷电路板（PCB）。 半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。 第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。 第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。 第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。 在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。