Invention Grant
US07223617B2 Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
有权
半导体激光器件和将半导体激光器部件安装在基座上的方法
- Patent Title: Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
- Patent Title (中): 半导体激光器件和将半导体激光器部件安装在基座上的方法
-
Application No.: US10629544Application Date: 2003-07-30
-
Publication No.: US07223617B2Publication Date: 2007-05-29
- Inventor: Atuhito Mochida, deceased
- Applicant: Korekazu Mochida, legal representative , Kyoko Mochida, legal representative , Hiroto Inoue , Suguru Nakao , Yukihiro Iwata , Akira Takamori , Hideto Adachi , Masatoshi Tamura
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.
Public/Granted literature
- US20060171434A1 Semiconductor laser device and a method of mounting a semiconductor laser component on a submount Public/Granted day:2006-08-03
Information query
IPC分类:
