公开(公告)号：US07223617B2

公开(公告)日：2007-05-29

申请号：US10629544

申请日：2003-07-30

申请人： Korekazu Mochida, legal representative ,  Kyoko Mochida, legal representative ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura

发明人： Atuhito Mochida, deceased

IPC分类号： H01L21/00

CPC分类号： H01S5/02272 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/83192

摘要： A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.

摘要翻译： 一种安装半导体激光器部件的方法，该半导体激光器部件能够防止半导体激光器部件的温度升高和残余应力引起的激光特性劣化和半导体激光部件的破坏。 半导体激光器部件通过加热和压接而安装在基座上，并且在释放的压力下再次被加热到接合部件的熔点以上以释放残余应力。