发明授权
US07223617B2 Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
有权
半导体激光器件和将半导体激光器部件安装在基座上的方法
- 专利标题： Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
- 专利标题（中）： 半导体激光器件和将半导体激光器部件安装在基座上的方法
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申请号： US10629544申请日： 2003-07-30
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公开(公告)号： US07223617B2公开(公告)日： 2007-05-29
- 发明人: Atuhito Mochida, deceased
- 申请人： Korekazu Mochida, legal representative , Kyoko Mochida, legal representative , Hiroto Inoue , Suguru Nakao , Yukihiro Iwata , Akira Takamori , Hideto Adachi , Masatoshi Tamura
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.