发明授权
- 专利标题: Non-outgassing low activation energy resist
- 专利标题(中): 非除气低活化能抵抗
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申请号: US11228589申请日: 2005-09-15
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公开(公告)号: US07226718B2公开(公告)日: 2007-06-05
- 发明人: Heidi B. Cao , Wang Yueh , Jeanette M. Roberts
- 申请人: Heidi B. Cao , Wang Yueh , Jeanette M. Roberts
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: G03F7/039
- IPC分类号: G03F7/039 ; G03F7/38 ; G03F7/30
摘要:
Numerous embodiments of a method to prevent outgassing from a low activation energy photoresist are described. In one embodiment of the present invention, a photoresist material is dispensed over a substrate to form a photoresist layer. The photoresist layer includes branched polymers coupled with acetal or ketal linkages. An exposed portion of the photoresist layer is exposed to a radiation treatment to cleave the acetal or ketal linkages and separate the branched polymers. The photoresist layer is baked at a temperature below about 100° C., and the separated branched polymers are too large to outgass from the photoresist layer.
公开/授权文献
- US20070059634A1 NON-OUTGASSING LOW ACTIVATION ENERGY RESIST 公开/授权日:2007-03-15
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