Invention Grant
US07235155B2 Method and apparatus for monitoring plasma conditions using a monitoring ring
失效
使用监测环监测等离子体条件的方法和装置
- Patent Title: Method and apparatus for monitoring plasma conditions using a monitoring ring
- Patent Title (中): 使用监测环监测等离子体条件的方法和装置
-
Application No.: US10788328Application Date: 2004-03-01
-
Publication No.: US07235155B2Publication Date: 2007-06-26
- Inventor: Steven T. Fink
- Applicant: Steven T. Fink
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00
Abstract:
A plasma processing system is provided that allows for monitoring a plasma processing system during plasma processing. The plasma processing system includes a processing chamber and a monitoring system for monitoring conditions of the processing chamber. By providing tools within a tool housing that is protected from the plasma environment but still in very close proximity thereto, better process monitoring can be achieved.
Public/Granted literature
- US20040177922A1 Method and apparatus for monitoring plasma conditions using a monitoring ring Public/Granted day:2004-09-16
Information query
IPC分类:
