发明授权
US07235457B2 High permeability layered films to reduce noise in high speed interconnects
有权
高磁导率分层膜，以降低高速互连中的噪声
- 专利标题： High permeability layered films to reduce noise in high speed interconnects
- 专利标题（中）： 高磁导率分层膜，以降低高速互连中的噪声
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申请号： US10099217申请日： 2002-03-13
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公开(公告)号： US07235457B2公开(公告)日： 2007-06-26
- 发明人: Leonard Forbes , Kie Y. Ahn , Salman Akram
- 申请人： Leonard Forbes , Kie Y. Ahn , Salman Akram
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Schwegman, Lundberg, Woessner & Kluth, P.A.
- 主分类号： H01L21/76
- IPC分类号： H01L21/76 ; H01L21/4763 ; H01L21/44
摘要：
This invention provides a structure and method for improved transmission line operation on integrated circuits. One method of the invention includes forming transmission lines in an integrated circuit. The method includes forming a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A pair of layered high permeability shielding lines are formed on the first layer of insulating material. The pair of layered high permeability shielding lines include layered permalloy and/or Ni45Fe55 films. A transmission line is formed on the first layer of insulating material and between and parallel with the pair of layered high permeability shielding lines.
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