发明授权
US07243480B2 Wafer fixing and marking 有权
晶圆固定和标记

Wafer fixing and marking
摘要:
The invention relates to a method for individually packing sheet or film-type materials in an automatic manner, said materials consisting of at least one material layer, in a packing unit with marked contents. A marking (40) made of a waxy marking material is applied to a warmed first packing material strip (20). The sheet or film-type material (10) is fixed to the marking wit surface thereof, whereby the roughness of the surface thereof is greater than the roughness of the surface of the first packing material strip. A second packing material strip (30) is applied to the sheet or film-type material and is connected to the first packing material strip in order to form a closed packing unit. The packing unit (35) is cooled and the marking is separated from the first packing material strip. A secure packing method and a marking for sheet or film-type materials are developed according to said inventive method.
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