发明授权
- 专利标题: Wafer fixing and marking
- 专利标题(中): 晶圆固定和标记
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申请号: US10565579申请日: 2004-07-14
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公开(公告)号: US07243480B2公开(公告)日: 2007-07-17
- 发明人: Wolfgang Schäfer
- 申请人: Wolfgang Schäfer
- 申请人地址: DE Andernach
- 专利权人: LTS Lohmann Therapie-Systeme AG
- 当前专利权人: LTS Lohmann Therapie-Systeme AG
- 当前专利权人地址: DE Andernach
- 代理机构: Frommer Lawrence & Haug LLP
- 国际申请: PCT/EP2004/007749 WO 20040714
- 国际公布: WO2005/012097 WO 20050210
- 主分类号: B65B9/02
- IPC分类号: B65B9/02 ; B65B61/00
摘要:
The invention relates to a method for individually packing sheet or film-type materials in an automatic manner, said materials consisting of at least one material layer, in a packing unit with marked contents. A marking (40) made of a waxy marking material is applied to a warmed first packing material strip (20). The sheet or film-type material (10) is fixed to the marking wit surface thereof, whereby the roughness of the surface thereof is greater than the roughness of the surface of the first packing material strip. A second packing material strip (30) is applied to the sheet or film-type material and is connected to the first packing material strip in order to form a closed packing unit. The packing unit (35) is cooled and the marking is separated from the first packing material strip. A secure packing method and a marking for sheet or film-type materials are developed according to said inventive method.
公开/授权文献
- US20060288662A1 Wafer fixing and marking 公开/授权日:2006-12-28
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