发明授权
- 专利标题： Integrated circuit coolant microchannel with compliant cover
- 专利标题（中）： 集成电路冷却剂微通道，带有合适的盖
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申请号： US11069540申请日： 2005-03-01
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公开(公告)号： US07243705B2公开(公告)日： 2007-07-17
- 发明人: Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
- 申请人： Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Buckley, Maschoff & Talwalkar LLC
- 主分类号： F28F7/00
- IPC分类号： F28F7/00 ; H05K7/20
摘要：
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
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