Invention Grant
- Patent Title: Method of polishing a tungsten-containing substrate
- Patent Title (中): 抛光含钨基材的方法
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Application No.: US10869397Application Date: 2004-06-16
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Publication No.: US07247567B2Publication Date: 2007-07-24
- Inventor: Robert Vacassy , Dinesh N. Khanna , Alexander Simpson
- Applicant: Robert Vacassy , Dinesh N. Khanna , Alexander Simpson
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Frank Koszyk
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
Public/Granted literature
- US20050282391A1 Method of polishing a tungsten-containing substrate Public/Granted day:2005-12-22
Information query
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