发明授权
- 专利标题： Radio frequency power amplifier module
- 专利标题（中）： 射频功率放大器模块
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申请号： US10830049申请日： 2004-04-23
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公开(公告)号： US07248118B2公开(公告)日： 2007-07-24
- 发明人: Masami Ohnishi , Tomonori Tanoue , Hidetoshi Matsumoto
- 申请人： Masami Ohnishi , Tomonori Tanoue , Hidetoshi Matsumoto
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2003-118030 20030423
- 主分类号： H03G3/10
- IPC分类号： H03G3/10
摘要：
A radio frequency power amplifier module that brings sufficient attenuation to a radio frequency signal in a bias supply line connecting a bias control part and a radio frequency power amplifier part without increasing module substrate area is aimed. At least one bonding pad 106 having a capacitance component to a ground and stitch structure inductances 108, 109 composed of a bonding wire 105 provided via the bonding pad are provided in the bias supply line connecting the bias control part and the radio frequency power amplifier part.
公开/授权文献
- US20040212438A1 Radio frequency power amplifier module 公开/授权日：2004-10-28
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