Invention Grant
US07250675B2 Method and apparatus for forming stacked die and substrate structures for increased packing density
有权
用于形成堆叠的管芯和衬底结构以增加堆积密度的方法和装置
- Patent Title: Method and apparatus for forming stacked die and substrate structures for increased packing density
- Patent Title (中): 用于形成堆叠的管芯和衬底结构以增加堆积密度的方法和装置
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Application No.: US10908277Application Date: 2005-05-05
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Publication No.: US07250675B2Publication Date: 2007-07-31
- Inventor: Benjamin V. Fasano , Brian R. Sundlof
- Applicant: Benjamin V. Fasano , Brian R. Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph Petrokaitis
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.
Public/Granted literature
- US20060249827A1 METHOD AND APPARATUS FOR FORMING STACKED DIE AND SUBSTRATE STRUCTURES FOR INCREASED PACKING DENSITY Public/Granted day:2006-11-09
Information query
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