发明授权
- 专利标题： Defect inspection method and apparatus therefor
- 专利标题（中）： 缺陷检查方法及其设备
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申请号： US10971109申请日： 2004-10-25
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公开(公告)号： US07251024B2公开(公告)日： 2007-07-31
- 发明人: Shunji Maeda , Atsushi Yoshida , Yukihiro Shibata , Minoru Yoshida , Sachio Uto , Hiroaki Shishido , Toshihiko Nakata
- 申请人： Shunji Maeda , Atsushi Yoshida , Yukihiro Shibata , Minoru Yoshida , Sachio Uto , Hiroaki Shishido , Toshihiko Nakata
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2000-231382 20000727
- 主分类号： G11B7/00
- IPC分类号： G11B7/00 ; G01J5/02 ; G01N21/35
摘要：
A defect inspection apparatus for inspecting a fine circuit pattern with high resolution to detect a defective portion is constructed to have an objective lens for detecting an image of a sample, a laser illumination unit for illuminating the sample through the objective lens, a unit for reducing the coherence of the laser illumination, an accumulation type detector, and a unit for processing the detected image signal.
公开/授权文献
- US20050083519A1 Defect inspection method and apparatus therefor 公开/授权日：2005-04-21
信息查询
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